The successful synthesis of large-area single-crystal heterostructure of 2D materials Zero-defect heterostructure, expected to be used as a core material for next-generation electronic devices SEOUL, ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

Flat materials that can morph into three-dimensional shapes have potential applications in architecture, medicine, robotics, space travel, and much more. But programming these shape changes requires ...