Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

Mechanical engineers face growing complexity in structural simulations. Modeling intricate geometries, capturing nonlinear material behaviors, and ensuring accurate boundary conditions often push ...

Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...

Ansys has released its latest toolsuite, 2025 R2, which has many products with AI+, together with a virtual AI assistant and enhanced data management and workflow automation. The 2025 R2 suite ...