Manufacturers of ball-grid-array (BGA) burn-in sockets are using a variety of processes to help them keep pace with the testing requirements posed by today's faster and denser integrated circuits.

Oyster Bay, N.Y. – Mill-Max's ball grid array socket/adapter systems can socket both BGA devices and interconnecting circuit boards. BGA socket/adapters provide a high-density and low-profile ...

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...

Ironwood Electronics has recently introduced a new BGA socket design using high-performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2086 socket is ...

BGA sockets simplify evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin sockets. BGA sockets come with easy open/close clamshell lids for ...

BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...

The SG-BGA-7199 socket isdesigned for 13.5 x 8 x 1.2mm package size and operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The contact resistance is typically20 milliohms per I/O ...

It was almost a year ago when we first heard details about AMD's plans for its top-dog mobile part for Zen 5, which goes by the name Strix Halo. For Zen 5 in laptops, AMD is developing two lines of ...