ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and ...

SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...

A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. “The trend ...

China has introduced a domestically engineered AI chip it claims can match or exceed the performance of NVIDIA’s advanced 4nm GPUs. The announcement, made at the ICC Global CEO Summit in Beijing, ...

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a ...