Scientists at Caltech have figured out how to precisely engineer tiny three-dimensional (3D) metallic pieces with nanoscale ...

Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...

New 2025 data reveals rising vehicle defects, increased software failures, and lower driver satisfaction, reshaping how ...

The defect rate for mortgages grew significantly across all loan types in the second quarter of 2024, continuing a trend seen in the first quarter. The share of loans with defects grew to 1.81%, ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that ...