The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...

Prairie View A&M secured state funding to expand 3D microelectronics training that supports Texas’ growing semiconductor sector.

Applied Materials is the largest supplier of technologies for heterogeneous integration (HI). The company’s newest solutions help chipmakers integrate chiplets into advanced 2.5D and 3D packages using ...

Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...

TOKYO, August 14, 2025--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...

Keeping pace with Moore’s law continues to be challenging and is driving adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than ...

At The Next FPGA Platform event in San Jose, California on January 22, Jose Alvarez, Intel PSG CTO, Jose Alvarez outlined the three levels of heterogeneous integration. It’s a simple taxonomy. First, ...