HONG KONG, Sept. 18, 2020 (GLOBE NEWSWIRE) -- At the World Semiconductor Congress 2020, Yu Xiekang, vice chairman of the China Semiconductor Industry Association, revealed that in the first half of ...
The Calibre DesignEnhancer software, which Siemens EDA unveiled at the Design Automation Conference (DAC) in July 2023, has been incorporated into a process design kit (PDK) of Samsung Foundry. The ...
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
His work is helping UC San Diego become a driving force in the nation’s growing semiconductor innovation ecosystem. Photo by ...
The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...
This image can scan APP Electronics straightly. This image can scan APP Electronics straightly. This post mainly talk about how APP Electronics to layout and repond in the future. HONG KONG, -- NON-US ...
The number of challenges is growing in power semiconductors, just as it is in traditional chips. Thermal dissipation and gradients, new design rules, and layout issues need to be considered, ...
HONG KONG, Sept. 04, 2020 (GLOBE NEWSWIRE) -- MobiusTrend, a market research organization in Hong Kong, recently released a research report on 'The layout of Google, Facebook, Microsoft, and WIMI ...
Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...
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