A tandem neural network capable of inferring key physical parameters of semiconductor materials from simple transistor measurements has been developed, as reported by researchers from the Institute of ...
With less than two months remaining until the 2026 International Compact Modeling Conference (ICMC), the Si2 Compact Model ...
TSMC, the world’s largest contract chipmaker, is now running semiconductor chemistry simulations roughly 50 times faster than ...
A new technical paper, “A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs,” was published by researchers at National Yang Ming Chiao Tung ...
ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.