Huawei's HiSilicon has introduced its first self-developed CMOS image sensor (CIS): the 50-megapixel CS5250. TechInsights' ...

At OCP 2026, Samsung and SK hynix both detailed strategies for addressing the memory demands of agentic AI’s key-value cache workloads, with coverage framing the announcements as further evidence that ...

Five Trends Reshaping Capex, Capacity and Fabs. Semiconductor capital spending is forecast to climb 27% in 2027, and memory is where the equipment mone ...

TechInsights delivers critical insights that empower fabless semiconductor companies to optimize chip design, outpace competitors, and lead with innovation. Maximize foundry performance with ...

Five Trends Reshaping HBM, DRAM and NAND. Memory will make up 62% of semiconductor revenue in 2027, up from around a quarter historically. TechInsights ...

Power your roadmap with predictive insights from TechInsights and uncover what leading semiconductor players are doing next to help you stay ahead of the curve.

Examine the impact of mature node chip overcapacity, price collapses, and global market implications. Learn how this shapes the semiconductor industry. As you know, China's massive capacity build-up ...

Stay ahead with insights into the dynamic pricing trends of DRAM and NAND memory. This report examines the past three months and forecasts the year ahead, covering Server DRAM, HBM, SSDs, UFS, and ...

Our Semiconductor Outlook Report series provides a comprehensive look into key trends in end markets and technologies. Unlock detailed analyses, forecasts, and expert perspectives on how the ...

TechInsights confirms Huawei subsidiary HiSilicon's 50 MP CS5250 CMOS image sensor in the Xiaotu S7 PRO MAX action camera. Explore preliminary teardown findings and learn how to access the full ...

The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, ...

Explore five trends shaping the AI market in 2027, from AI infrastructure and compute to memory, advanced packaging and semiconductor manufacturing. Advanced packaging will cap semiconductor growth in ...