Researchers from the National University of Singapore (NUS) have developed a boron-catalyzed method to transform oxetanes, ...
Three-dimensional (3D) packaging technology is currently considered the preferred solution beyond Moore’s law, while the through silicon via (TSV) technology is the core of 3D packaging technology.
Abstract: A numerical methodology for evaluating the effect of filler particle size distribution and volume fraction on the effective thermal and electrical properties of polymer insulation materials ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results