InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, ...

HSINCHU, July 15, 2025 -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

TAIPEI (Taiwan News) — TSMC’s advanced packaging plants AP8 in Southern Taiwan Science Park and AP7 in Chiayi are set to enter production in the second half of this year, Commercial Times reported ...

Apple has begun mass production of its next-generation M5 chip, according to South Korean media, with the processor expected to arrive in devices potentially as soon as this year. ET News reports that ...

TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...

What processors will be running the Apple bargains we’ll be seeking to purchase on Cyber Monday 2025? Presumably, Apple’s M5 chips will be inside some of them, with work already under way on the next ...