Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...

Advanced packaging often relies on silicon interposers to connect chiplets and other components inside a package. The problem is that interposers typically exceed the reticle limit, which adds both ...

After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the best metallization choice. Yet it remains ...

While the concept of quantum computing has been discussed for more than 40 years, only recently have experiments indicated ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...